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thermowave — Brand of Nexson Group

Air Cooling Solutions

Data Center & Semiconductor

Modern data centers feature rising computing density, strict low-noise standards and low PUE energy-saving requirements. Air cooling systems face heat attenuation risks caused by dust deposition. Heat exchangers need low air resistance, ultra-low noise, high energy efficiency and easy maintenance to balance server heat dissipation, fan power consumption and constant room temperature, ensuring stable and energy-efficient data center operation.

Air Cooling Solutions

Typical Process & Heat Exchanger Stations

Process and heat exchanger station diagram

Industry Overview

1. Industry Demand

Modern data centers feature rising computing density, strict low-noise standards and low PUE energy-saving requirements. Air cooling systems face heat attenuation risks caused by dust deposition. Heat exchangers need low air resistance, ultra-low noise, high energy efficiency and easy maintenance to balance server heat dissipation, fan power consumption and constant room temperature, ensuring stable and energy-efficient data center operation.

2. Core Working Stations

Core scenarios include CRAC room air conditioning heat exchange, server rack auxiliary cooling, exhaust waste heat recovery and fresh air preheating, as well as chip-level precision temperature control. Widely applied in high-density computing data centers, it stabilizes IT equipment operation, reduces noise and optimizes overall PUE.

3. Core Equipment

1. Thermowave Thermoline Gasketed Heat Exchanger: Core unit for precision air conditioning, low-resistance and low-noise, detachable and dust-cleanable, maintaining stable room temperature and long-term high energy efficiency; 2. Nexson GreenP&S Plate-and-Shell Heat Exchanger: Dedicated for server auxiliary cooling, compact and vibration-resistant, reducing local hotspots, fan energy consumption and operating noise for stable computing performance; 3. Nexson GreenMicro Brazed Heat Exchanger: Precision temperature control equipment, ultra-compact and high-precision, suitable for chip and UPS cooling, realizing low-grade waste heat recovery and further energy efficiency improvement.

Equipment for This Industry

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