Liquid Cooling Solutions

1. Industry Demand

High-density computing data centers feature rack power from 20 kW up to 100 kW, making traditional air cooling inadequate for intensive heat dissipation. Liquid cooling requires compatible heat exchange equipment for glycol, mineral oil and fluorinated liquid, supporting 24/7 continuous operation in confined spaces. Heat exchangers demand high efficiency, zero leakage, low flow resistance and easy maintenance to stabilize chip temperature, avoid computing attenuation and achieve ultra-low PUE.

2. Core Working Stations

Core scenarios include high-density rack precise cooling, coolant circulation heat regulation, ultra-high-power rack heat dissipation reinforcement, overall room temperature balancing and liquid cooling waste heat recovery. Widely applied in AI supercomputing centers and high-density server clusters, it ensures stable hardware operation, consistent computing performance and energy efficiency improvement.

3. Core Equipment

1. Thermowave Thermoline Gasketed Heat Exchanger: Flagship liquid cooling equipment, high-efficiency and low-resistance, compatible with multiple coolants, enabling easy maintenance and precise temperature stabilization for mainstream high-density racks; 2. Nexson GreenBox Fully Welded Heat Exchanger: Reinforcement equipment for ultra-high-density scenarios, leak-free and corrosion-resistant to special fluorinated liquid, supporting stable heavy-duty operation of 20–100 kW supercomputing racks; 3. Thermowave Thermoline Semi-Welded Heat Exchanger: Dedicated for coolant circulation, anti-clogging and parameter-adjustable, adapting to fluctuating computing loads and ensuring long-term stable circulation efficiency; 4. Nexson GreenP&S Plate-and-Shell Heat Exchanger: Core equipment for overall room heat management, compact and structurally stable, eliminating local hotspots and stabilizing cluster operation.