247 delivery records across 6 industries — archived by sector, searchable anytime
SMIC Lingang 12-inch wafer foundry line, serving advanced-node chip manufacturing and keeping the line running stably — a core carrier of domestic high-end chip self-sufficiency.
SMIC Oriental 2025 FAB9-P2 facility WWT system: process cooling water plus fluoride and ammonia wastewater treatment meeting national Class-A discharge standards, a regional benchmark for green semiconductor manufacturing.
Ultrapure water process package for a 12-inch wafer fab, supporting chip production temperature control and heat exchange to raise line efficiency.
Heat exchange package for the ultrapure water system, ensuring stable water quality and precise temperature control.
Terminal heat exchange package for a new pure water system, meeting semiconductor high-cleanliness production requirements.
SMIC Shenzhen 12-inch wafer fab: temperature control and heat exchange for chip production, improving line efficiency.
14nm/7nm FinFET advanced-node SN1 project, supporting advanced process R&D and volume production.
8-inch specialty-process IC manufacturing project, localizing and upgrading the regional chip industry.
Xi'an ESWIN Materials 12-inch large silicon wafer base project.
12-inch semiconductor polished and epitaxial silicon wafer project, raising regional supply capacity for memory, logic and image sensor chips.
Chongqing Yineng 8-inch silicon carbide wafer base phase I — a third-generation semiconductor SiC IDM line for automotive-grade trench SiC MOSFET wafers, with epitaxy, wafer processing and R&D labs; part of the ESWIN group ecosystem.
CXMT Beijing DRAM R&D and production base in the Beijing Economic-Technological Development Area, one of China's main 12-inch DRAM R&D and mass production sites.
CXMT Xinqiao 12-inch DRAM base (Haitang project / Fab A2) for server, PC and automotive memory, at 80,000 12-inch wafer starts per month.
HBM advanced packaging base wholly owned by CXMT; total investment over RMB 17 billion, 30,000 12-inch wafers packaged per month, targeting HBM and high-end DRAM packaging for AI servers, computing power and automotive storage.
CXMT Hefei DRAM base phase I, China's first domestic DRAM mass production line, planned at 120,000 12-inch DRAM wafers per month.
Total investment RMB 8.1 billion; China's first CIDM collaborative IC manufacturing platform led by Dr. Chang Ru-jing, an 8/12-inch specialty foundry focused on automotive power devices, BCD, MCU and analog chips.
Wuhan 3D NAND flash base phase I/II, each planned at 100,000 12-inch 3D NAND wafers per month.
National memory base with planned capacity of 100,000 next-generation high-stack 3D NAND wafers per month and much higher domestic content in line equipment; China's only full-chain 3D NAND IDM base at scale.
Founded by Zhejiang Juhua and the National IC Industry Investment Fund, a leading domestic G5-grade wet electronic chemicals supplier.
Jingrui Malaysia new plant with annual output of 240,000 8-inch SiC substrates — the first overseas compound semiconductor base of Jingrui at scale.
Suzhou high-end IC materials production base, a benchmark domestic 12-inch silicon wafer project with planned annual output of 2.94 million polished 12-inch wafers and 1.2 million epitaxial wafers.
Industrial water treatment and environmental engineering for semiconductor and electronics customers: ultrapure water process package with wastewater treatment for stable UPW supply.
Leading domestic semiconductor materials maker for lithography-related materials and high-purity chemicals; ultrapure water package meeting high-purity chemical production and R&D needs.
Jinqiao phase III retrofit adding an ultrapure water system to meet production demand.
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