247 delivery records across 6 industries — archived by sector, searchable anytime
12-inch wafer line on mature nodes for power devices, MCU and analog chips.
Wuxi Hua Hong FAB9B phase III expansion: 12-inch specialty process line at 28/22nm for power devices, automotive chips and analog IC customers.
Leading domestic 12-inch wafer-level hybrid bonding 3D advanced packaging base for Chiplet, HBM and heterogeneous integration of computing chips; total investment RMB 11 billion over 178 mu, two 12-inch lines at 20,000 wafers per month.
Core products: semiconductor wet chemicals, CMP slurries, photoresist strippers, developers, wafer cleaners and diffusion sources, for 8/12-inch fabs, advanced packaging and display panels.
Dedicated to advanced sensor technology innovation, working with leading upstream and downstream players on common technology R&D to build a world-class intelligent sensor innovation center.
Guide Infrared industrial park phase II, about 150,000 m², for infrared focal plane detector chip R&D, MEMS infrared device packaging, optical module assembly and pilot labs.
IC equipment localization, integration and verification platform expansion: adding 30,000 8-inch silicon wafers and 5,000 6-inch SiC wafers per month.
Serving high-end semiconductor packaging substrates (PBGA, memory chip substrates, FCBGA), precision plating and patterning; mid-end substrate manufacturing with continuous line upgrades at the Shanghai site.
Semiconductor production support process project for advanced-node chip manufacturing, keeping the line running stably.
High-performance optoelectronic device industrial park with total investment of about RMB 1.5 billion: high-speed optical modules, CPO, silicon photonics and wafer-level optoelectronic devices for AI data center optical interconnect.
51GWh power and storage battery base in Xinyang, Henan; M1 cell project with total investment of RMB 9.63 billion for LFP storage cells and passenger-vehicle power cells.
Suzhou Xingyao Photonics 8-inch silicon photonics integrated chip line, total investment RMB 5 billion; phase I builds China's first 8-inch 90nm silicon photonics foundry line.
High-end HDI PCB expansion for AI servers and switches, total investment over RMB 70 million.
Power battery intelligent manufacturing base invested by CALB and Leapmotor, total investment RMB 7.5 billion, planned annual output 33.6GWh prismatic power cells (LFP / high-nickel NMC).
Power semiconductor IDM with integrated 6-inch wafer manufacturing and packaging/test, serving industrial control, new energy and automotive electronics.
Founded in December 1994 and wholly owned by Samsung Electronics of Korea, engaged in DRAM, NAND and HBM memory chip packaging and testing.
Wuhan Optics Valley advanced packaging pilot platform F10 infrastructure — a top domestic 12-inch advanced packaging pilot base for Chiplet, 2.5D/3D and wafer-level packaging in AI computing chips, silicon photonics and sensing-memory-computing integration.
High-end compound semiconductor materials and chip industrialisation base: a full-chain second-generation compound semiconductor site producing GaAs and InP substrates, epitaxial wafers, optical communication chips, lasers and detectors for AI optical modules, CPO, fiber sensing and LiDAR.
YOFC Wuhan silicon carbide project, total investment RMB 20 billion, full-chain IDM model covering SiC epitaxy, 6-inch SiC wafer manufacturing and power device packaging and testing.
Wuhan Chuxing semiconductor project with total investment of RMB 50 billion for 12-inch mature-node foundry: CIS image sensors, power devices, analog and power management chips for IoT, consumer electronics and industrial sensing.
BOE HC SemiTek (Wuhan) LED/MEMS chip base: GaN blue-green LED, Mini/Micro LED epitaxy and chips, MEMS inertial sensors, plus optical communication and AR display chips.
Major global optical fiber preform production base using the VAD and OVD processes for preforms, fiber drawing and cable manufacturing.
Gen-6 LTPS AMOLED flexible display panel line, total investment RMB 26.5 billion; China's earliest Gen-6 flexible AMOLED line in mass production, making rigid and flexible OLED panels for phones, wearables, automotive displays and VR.
One of China's largest electronic-grade polysilicon producers for the semiconductor industry; the project completes full-process support for wafer manufacturing.
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